C10100 (ASTM Standard), also known as Oxygen-Free Copper (OFC). Purity ≥99.99%, Oxygen Content ≤0.0005%.
Ultra-High Electrical Conductivity (≥101% IACS) and Thermal Conductivity.
Extremely Low Oxygen Content, eliminating hydrogen embrittlement risk, suitable for high-temperature reducing environments.
Excellent Cold/Hot Workability with strong ductility.
Superior Corrosion Resistance, especially in vacuum or inert atmospheres.
Product Form | Thickness (mm) | Width/Diameter (mm) | Length (mm) |
Plate | 0.1~50 | 50~600 | 500~6000 |
Strip | 0.05~3.0 | 10~300 | Coil (Customized) |
Wire | - | Φ0.1~20 | Coil / Straight |
Tube | Wall: 0.5~10 | Φ5~200 | 1000~6000 |
Cu | O | Other Impurities (Total) |
≥99.99 | ≤0.0005 | ≤0.001 |
Density (g/cm³) | Melting Point (°C) | Conductivity (%IACS) | Thermal Conductivity (W/m·K) |
8.94 | 1083 | 101~103 | 398 |
Condition | Tensile Strength (MPa) | Yield Strength (MPa) | Elongation (%) |
Annealed (O) | 200~220 | 50~70 | ≥45 |
Hard Temper (H) | 300~350 | 280~320 | 3~8 |
Purity Benchmark: Ultra-low oxygen content reduces grain boundary embrittlement, extending service life at high temperatures.
Energy Efficiency Optimization: Higher conductivity than standard pure copper (C11000), minimizing energy transmission loss.
Adaptability for Precision Machining: Suitable for complex processes like stamping, deep drawing, and welding.
Electronics: Semiconductor lead frames, high-frequency coaxial cables.
Energy Equipment: Vacuum tube anodes, fusion reactor liners.
High-End Manufacturing: Superconducting magnet windings, laser cavity cooling components.
Annealing: Perform under hydrogen or nitrogen atmosphere (400~600°C) to prevent oxidation.
Cold Working: Recommended deformation per pass ≤30% to avoid stress concentration and cracking.
Welding: TIG welding preferred; argon purity ≥99.995%.
① High-Frequency Communication & Electronics
Millimeter Wave Radar Antennas: For 5G base stations & automotive radar, utilizing low signal loss characteristics.
High-Frequency Circuit Substrates: Microstrip line/coplanar waveguide substrates in satellite communication equipment, ensuring high-frequency stability.
② New Energy Vehicles & Charging Infrastructure
Power Battery Tabs/Connectors: High conductivity reduces resistive heating, improving charge/discharge efficiency.
Fast Charger Internal Conductors: Supports high-current transmission, minimizing energy waste.
③ Precision Instruments & Sensors
High-Accuracy Temperature Probes: Thermocouple protection sheaths, resistant to high temperature with uniform thermal conductivity.
MEMS (Micro-Electro-Mechanical Systems) Wiring: Ultra-fine wires (Φ<0.1mm) for micro-sensor interconnects.
④ Renewable Energy Equipment
Photovoltaic Ribbon: Interconnects solar cells, low resistance enhances photovoltaic conversion efficiency.
Wind Power Converter Heat Sink Baseplates: Optimizes thermal management through high thermal conductivity, extending equipment life.
⑤ High-End Consumer Electronics
Hi-Fi Audio Cables: OFC reduces audio signal distortion, enhancing sound purity.
Ultra-Thin Foldable Screen Hinges: High ductility supports precision stamping.
⑥ Special Industrial Equipment
EDM (Electrical Discharge Machining) Electrodes: High purity ensures uniform discharge, achieving surface finishes up to Ra 0.2μm.
Vacuum Deposition Evaporation Sources: Resistant to high-temperature sublimation, enabling high film deposition consistency.
⑦ Emerging Technology Fields
Quantum Computer Superconducting Coils: Maintains stable conductivity in cryogenic environments (-269°C).
3D Printing Metal Powder: Used in Electron Beam Melting (EBM) for printing complex high-thermal-conductivity parts.
Supplemental Note:
The above scenarios leverage the combined "Purity + Conductivity + Workability" advantages of C10100, making it particularly suitable for applications demanding high material reliability, energy efficiency, or precision manufacturing.
A: C10200 has an oxygen content ≤0.001%, slightly lower conductivity (100% IACS), and lower cost.
A: Vacuum packing or nitrogen-filled storage is recommended, with humidity ≤40%RH.
A: Silver/nickel/tin plating is possible; acid cleaning (e.g., 5% sulfuric acid solution) is required first to remove surface oxides.
ASTM: B152/B152M (Plate/Strip)
EN: CW008A (EU Oxygen-Free Copper Standard)
GB/T: T1 (China Highest Purity Pure Copper Grade)
Note: Specific parameters may vary based on production processes; refer to the factory test report for definitive values.
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