Ningbo Jintian Copper (Group) Co., Ltd.
Ningbo Jintian Copper (Group) Co., Ltd.
Copper

C10100 Copper

Copper

Grade Name

C10100 (ASTM Standard), also known as Oxygen-Free Copper (OFC). Purity ≥99.99%, Oxygen Content ≤0.0005%.


Product Features

  • Ultra-High Electrical Conductivity (≥101% IACS) and Thermal Conductivity.

  • Extremely Low Oxygen Content, eliminating hydrogen embrittlement risk, suitable for high-temperature reducing environments.

  • Excellent Cold/Hot Workability with strong ductility.

  • Superior Corrosion Resistance, especially in vacuum or inert atmospheres.


Common Product Forms & Dimensions

Product Form

Thickness (mm)

Width/Diameter (mm)

Length (mm)

Plate

0.1~50

50~600

500~6000

Strip

0.05~3.0

10~300

Coil (Customized)

Wire

-

Φ0.1~20

Coil / Straight

Tube

Wall: 0.5~10

Φ5~200

1000~6000


Chemical Composition (%)

Cu

O

Other Impurities (Total)

≥99.99

≤0.0005

≤0.001


Copper C10100 Material Properties

Physical Properties

Density (g/cm³)

Melting Point (°C)

Conductivity (%IACS)

Thermal Conductivity (W/m·K)

8.94

1083

101~103

398


Mechanical Properties

Condition

Tensile Strength (MPa)

Yield Strength (MPa)

Elongation (%)

Annealed (O)

200~220

50~70

≥45

Hard Temper (H)

300~350

280~320

3~8


Core Advantages

  • Purity Benchmark: Ultra-low oxygen content reduces grain boundary embrittlement, extending service life at high temperatures.

  • Energy Efficiency Optimization: Higher conductivity than standard pure copper (C11000), minimizing energy transmission loss.

  • Adaptability for Precision Machining: Suitable for complex processes like stamping, deep drawing, and welding.


Product Applications

  • Electronics: Semiconductor lead frames, high-frequency coaxial cables.

  • Energy Equipment: Vacuum tube anodes, fusion reactor liners.

  • High-End Manufacturing: Superconducting magnet windings, laser cavity cooling components.


Processing Notes

  • Annealing: Perform under hydrogen or nitrogen atmosphere (400~600°C) to prevent oxidation.

  • Cold Working: Recommended deformation per pass ≤30% to avoid stress concentration and cracking.

  • Welding: TIG welding preferred; argon purity ≥99.995%.


Key Application Scenarios (Expanded & Detailed)

① High-Frequency Communication & Electronics

Millimeter Wave Radar Antennas: For 5G base stations & automotive radar, utilizing low signal loss characteristics.

High-Frequency Circuit Substrates: Microstrip line/coplanar waveguide substrates in satellite communication equipment, ensuring high-frequency stability.


② New Energy Vehicles & Charging Infrastructure

Power Battery Tabs/Connectors: High conductivity reduces resistive heating, improving charge/discharge efficiency.

Fast Charger Internal Conductors: Supports high-current transmission, minimizing energy waste.


③ Precision Instruments & Sensors

High-Accuracy Temperature Probes: Thermocouple protection sheaths, resistant to high temperature with uniform thermal conductivity.

MEMS (Micro-Electro-Mechanical Systems) Wiring: Ultra-fine wires (Φ<0.1mm) for micro-sensor interconnects.


④ Renewable Energy Equipment

Photovoltaic Ribbon: Interconnects solar cells, low resistance enhances photovoltaic conversion efficiency.

Wind Power Converter Heat Sink Baseplates: Optimizes thermal management through high thermal conductivity, extending equipment life.


⑤ High-End Consumer Electronics

Hi-Fi Audio Cables: OFC reduces audio signal distortion, enhancing sound purity.

Ultra-Thin Foldable Screen Hinges: High ductility supports precision stamping.


⑥ Special Industrial Equipment

EDM (Electrical Discharge Machining) Electrodes: High purity ensures uniform discharge, achieving surface finishes up to Ra 0.2μm.

Vacuum Deposition Evaporation Sources: Resistant to high-temperature sublimation, enabling high film deposition consistency.


⑦ Emerging Technology Fields

Quantum Computer Superconducting Coils: Maintains stable conductivity in cryogenic environments (-269°C).

3D Printing Metal Powder: Used in Electron Beam Melting (EBM) for printing complex high-thermal-conductivity parts.


Supplemental Note:
The above scenarios leverage the combined "Purity + Conductivity + Workability" advantages of C10100, making it particularly suitable for applications demanding high material reliability, energy efficiency, or precision manufacturing.


Frequently Asked Questions (FAQ)

Q1: What is the difference between C10100 and C10200?

A: C10200 has an oxygen content ≤0.001%, slightly lower conductivity (100% IACS), and lower cost.


Q2: How to store to prevent oxidation?

A: Vacuum packing or nitrogen-filled storage is recommended, with humidity ≤40%RH.


Q3: Is plating supported?

A: Silver/nickel/tin plating is possible; acid cleaning (e.g., 5% sulfuric acid solution) is required first to remove surface oxides.


Standards Reference

  • ASTM: B152/B152M (Plate/Strip)

  • EN: CW008A (EU Oxygen-Free Copper Standard)

  • GB/T: T1 (China Highest Purity Pure Copper Grade)

Note: Specific parameters may vary based on production processes; refer to the factory test report for definitive values.


Start Your Partnership With JINTIAN COPPER!
Whether you have any questions about our products, please feel free to contact us, we will reply as soon as possible.